[GIGAIPC] 산업용 임베디드 PC QBiX Jumbo Series (High Performance Modular IPC) QBiX-JMB-ADLA67EHG-B1
Key Features
Industrial system with Intel® Q670E Chipset, support for Intel® 14th/13th/12th Gen Processors and Discrete GFX card
•System Size : 224W x 368D x 166.3H(mm) - Discrete GFX card support (optional)
•Support Intel® 14th/13th/12th Gen Processor
•Dual Channel DDR4, 2 x SO-DIMMs
•DVI-D, VGA & DP ports for multiple display
•1 x 2.5GbE LAN Port
•3 x GbE LAN Ports
Specification
Dimension
224W x 368D x 166.3H(mm) - Discrete GFX support (Optional)
CPU
Support for 14th/13th/12th Generation
Intel® Core™ i9/i7/i5/i3, Pentium® and Celeron® processors in the LGA1700 package
TDP under 65W
Chipset
Intel® Q670E Express Chipset
Memory
2 x DDR4 SO-DIMM sockets, Max. Capacity 64 GB
Support Dual channel DDR4 3200 MHz memory modules
Ethernet
1 x 2.5GbE LAN Port (Intel® I226V)
1 x GbE LAN Port (Intel® I219LM, Vpro support)
2 x GbE LAN Ports (Intel® I211AT)
Graphics Support
Integrated Graphics Processor - depends on CPU:
1 x DP port, supporting a maximum resolution of 4096x2160 @60Hz
1 x DVI-D port, supporting a maximum resolution of 1920x1080 @60Hz
1 x VGA port, supporting a maximum resolution of 1920x1080 @60Hz
(3 independent display outputs)
Audio
Realtek® ALC897
Storage
4 x 2.5" HDD/SSD (SATA 6Gb/s) -- support RAID 0/1/5/10
Expansion-Slots
1 x 2280 M.2 M-Key (PCIe Gen4x4)
1 x 2230 M.2 E-Key (WiFi/BT)
1 x Full-size Mini PCIe with SIM slot
1 x PCIe slot -- Discrete riser card support
Front I/O
1 x Power Switch/Power/HDD LED
3 x Audio Jacks (Line in, Line out, Mic in)
1 x Display port
1 x DVI-D
1 x VGA
2 x COM Ports (RS-232/422/485 & RI/5V/12V)
2 x COM Ports (RS-232)
4 x RJ45 LAN Ports
2 x USB 3.2 Gen 2x1
2 x USB 3.2 Gen 1
6 x USB 2.0
1 x 4-pin Terminal Block
2 x External Antenna Holes (Optional)
Riser card (Optional)
1 x PCIe x4 (Gen3 x4)
2 x PCIe x16
— Single at Gen3 x16 only
or
— Dual at Gen3 x8 + Gen3 x8
Power
+24V~48VDC (Full Range) -- Support discrete GFX card
Operation Temperature
For Main system :
Operating temperature: -20°C to 50°C (CPU TDP 65W)
Operating temperature: -20°C to 60°C (CPU TDP 35W)
For Full system :
Depends on the Graphic cards installed in the system
Operating humidity: 0-90% (non-condensing)
Non-operating temperature: -40°C to 85°C
Non-operating humidity: 0%-95% (non-condensing)
Use wide temperature range memory and storage
Vibration During Operation
Operation: IEC 60068-2-64, 1 Grms, random, 5 ~ 500 Hz, 1 hr / Per Axis, With SSD/M.2 2280 & Without Graphics Cards
Non-operation: IEC 60068-2-6, 2 G, Sine, 10 ~ 500 Hz, 1 Oct/min, 1 hr / Per Axis
Shock During Operation
Operation: IEC 60068-2-27, 50 G, half sine, 11 ms duration, With SSD
